Experience:

• Around 15 years of extensive hands-on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines.
• 5-7 years of progressive leadership or management experience.
• Breadth and depth on high performance team building, employee goal setting and performance management, talent hiring and nurturing, capability development, project acquisition, customer discussion, alignment with business objective and goals, QCD (quality, cost and delivery), strategy and execution, employee engagement, empowerment and delegation, competency and knowledge management.
• Proficient and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability.

Technical Skills:

• Expertise with simulation tools for high-speed electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
• Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
• Good understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.
• Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).